A) Weight, speed, and capacity
B) Density, clock speed, and wafer thickness
C) Size, heat, and power
D) Silicon availability, efficiency, and energy
E) Memory, cache size, and speed
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True/False
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Multiple Choice
A) connecting identical processors in a parallel combination and drawing power from the same source.
B) putting two or more lower power processor cores on a single chip.
C) connecting a series of high powered processors through a single power source.
D) slicing a flat chip into pieces and reconnecting the pieces vertically.
E) connecting a combination of parallel and series-connected processors to a single larger processor to supplement its functioning.
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Essay
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True/False
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Multiple Choice
A) bands
B) readers
C) training
D) iPod Touch PDAs
:
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Multiple Choice
A) personal computers
B) mainframe computers
C) minicomputers
D) Internet computing
E) laptops
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Multiple Choice
A) consult the e-Stewards program
B) seek advice from the International Association of Electronics Recyclers
C) look for partners with ISO 9001 and ISO 14001 certifications
D) investigate resources provided by the Basel Action Network
E) all of the above
F) none of the above
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True/False
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True/False
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True/False
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Multiple Choice
A) Financial risk modeling
B) Gene analysis
C) Linear problems
D) Parallel problems
E) Manufacturing simulation
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Multiple Choice
A) Rising transportation costs greatly increase the costs of manufacturing and make moving inventory between locations highly expensive.
B) Chip manufacturers maintain low inventories to hedge the move of semiconductor technology away from silicon-based chips.
C) The potential physical and electronic damage to silicon chips if left unused for extended periods of time deters manufacturers from maintaining higher inventories.
D) Chip manufacturers leverage the higher costs of chip-based products to their advantage by keeping supply low compared to demand.
E) Products with a significant chip-based component rapidly fall in value and can cause huge losses when overproduced.
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